A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. - Robin C. J. Wang; Chang-Chun Lee; L. D. Chen; Kenneth Wu; K. S. Chang-Liao (Microelectron. Reliab., 2006)

Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. - C. C. Chiu; H. H. Chang; Chang-Chun Lee; C. C. Hsia; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. - Chang-Chun Lee; Chien-Chen Lee; Hsiao-Tung Ku; Shu-Ming Chang; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. - T. Y. Hung; S. Y. Chiang; C. J. Huang; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2011)

Light degradation test and design of thermal performance for high-power light-emitting diodes. - Yen-Fu Su; Shin-Yueh Yang; Tuan-Yu Hung; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2012)

Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. - Tao-Chih Chang; Chang-Chun Lee; Chia-Ping Hsieh; Sheng-Che Hung; Ren-Shin Cheng (Microelectron. Reliab., 2015)

Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology. - Chang-Chun Lee; Chien-Chao Huang (Microelectron. Reliab., 2015)

Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays. - Chang-Chun Lee; Chuan-Hsi Liu; Dian-Yong Li; Chia-Ping Hsieh (Microelectron. Reliab., 2018)

Neural Architecture Search for Inversion. - Cheng Zhan; Licheng Zhang; Xin Zhao; Chang-Chun Lee; Shujiao Huang (CoRR, 2022)

A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. - Y. H. Lin; Chang-Chun Lee; C. Y. Liao; M. H. Lin; W. C. Tu; Robin Chen; H. P. Chen; Winston S. Shue; Min Cao (IRPS, 2023)

Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. - Chi-Wei Wang; Che-Pei Chang; Chang-Chun Lee (IRPS, 2023)

Mechanical reliability of high-power modules via simulation-based machine learning. - Chang-Chun Lee; Wei-Cheng Tsai; Jui-Chang Chuang (Eng. Appl. Artif. Intell., 2025)