Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications. - Kyung-Woon Jang; Chang-Kyu Chung; Woong-Sun Lee; Kyung-Wook Paik (Microelectron. Reliab., 2008)

Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications. - Chang-Kyu Chung; Jae-Han Kim; Jong-Won Lee; Kyoung-Won Seo; Kyung-Wook Paik (Microelectron. Reliab., 2012)

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). - Kyoung-Lim Suk; Ho-Young Son; Chang-Kyu Chung; Joong Do Kim; Jin-Woo Lee; Kyung-Wook Paik (Microelectron. Reliab., 2012)