Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2005)

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. - Yi-Shao Lai; Ping-Feng Yang; Chang-Lin Yeh (Microelectron. Reliab., 2006)

Support excitation scheme for transient analysis of JEDEC board-level drop test. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2006)

Transient fracturing of solder joints subjected to displacement-controlled impact loads. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2006)

Evaluation of board-level reliability of electronic packages under consecutive drops. - Chang-Lin Yeh; Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Evaluation of solder joint strengths under ball impact test. - Yi-Shao Lai; Hsiao-Chuan Chang; Chang-Lin Yeh (Microelectron. Reliab., 2007)

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. - Tsung-Yueh Tsai; Chang-Lin Yeh; Yi-Shao Lai; Rong-Sheng Chen (Microelectron. Reliab., 2007)

Empirical correlation between package-level ball impact test and board-level drop reliability. - Chang-Lin Yeh; Yi-Shao Lai; Hsiao-Chuan Chang; Tsan-Hsien Chen (Microelectron. Reliab., 2007)

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. - Chang-Lin Yeh; Tsung-Yueh Tsai; Yi-Shao Lai (Microelectron. Reliab., 2007)

Effects of different drop test conditions on board-level reliability of chip-scale packages. - Yi-Shao Lai; Po-Chuan Yang; Chang-Lin Yeh (Microelectron. Reliab., 2008)

Finite element model verification for packaged printed circuit board by experimental modal analysis. - Ying-Chih Lee; Bor-Tsuen Wang; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. - Tsung-Yueh Tsai; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. - Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2008)

Characteristic of copper wire and transient analysis on wirebonding process. - Hsiang-Chen Hsu; Wei-Yao Chang; Chang-Lin Yeh; Yi-Shao Lai (Microelectron. Reliab., 2011)