A piezo-capacitive BAW accelerometer with extended dynamic range using a gap-changing moving electrode. - Anosh Daruwalla; Haoran Wen; Chang-Shun Liu; Hoon Jeong; Farrokh Ayazi (PLANS, 2018)

Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip. - Haoran Wen; Anosh Daruwalla; Yaesuk Jeong; Pranav Gupta; Jaehoo Choi; Chang-Shun Liu; Farrokh Ayazi (PLANS, 2018)

High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging. - Farrokh Ayazi; Haoran Wen; Yaesuk Jeong; Pranav Gupta; Anosh Daruwalla; Chang-Shun Liu (CICC, 2019)