Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. - Jongwoo Park 001; Jungpyo Hong; Miji Lee; Dongyoon Sun; Kyung Kang; Taesung Kim; Seungwon Kim; Sujin Kwon; Changkyu Joo; Sangsu Ha; Wooyeon Kim; Jongsu Ryu; et al. (IRPS, 2015)

Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation. - Jongwoo Park 001; Miji Lee; Kyunghwan Min; J.-K. Choi; Changkyu Joo; S.-C. Park; Hanbyul Kang; Sangwoo Pae (IRPS, 2015)