Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination. - Changle Zhi; Gang Dong; Yang Wang 104; Zhangming Zhu; Yintang Yang (IEEE Trans. Circuits Syst. I Regul. Pap., 2022)

Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method. - Wei Xiong; Gang Dong; Changle Zhi; Yang Wang 104; Zhangming Zhu; Yintang Yang (IEEE Trans. Very Large Scale Integr. Syst., 2023)

A 3-D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias. - Deguang Yang; Gang Dong; Changle Zhi; Daihang Liu; Yinghao Feng; Yintang Yang (IEEE Trans. Circuits Syst. II Express Briefs, 2024)

Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems. - Changle Zhi; Gang Dong; Wei Xiong; Deguang Yang; Daihang Liu; Yinghao Feng; Yang Wang 104; Zhangming Zhu; Yintang Yang (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2024)

Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks. - Yinghao Feng; Gang Dong; Daihang Liu; Changle Zhi; Deguang Yang; Yang Wang 104; Zhangming Zhu; Yintang Yang (J. Circuits Syst. Comput., 2024)

HMC Method for Defect Classification and Location of Postbond TSVs. - Changle Zhi; Gang Dong; Deguang Yang; Daihang Liu; Zhangming Zhu (IEEE Trans. Instrum. Meas., 2025)

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits. - Changle Zhi; Gang Dong; Deguang Yang; Daihang Liu; Yinghao Feng; Yang Wang 104; Zhangming Zhu (IEEE Trans. Very Large Scale Integr. Syst., 2025)

Transmission Channel and Matching Network Design Strategies in Chiplet-Based 2.5-D ICs for RF Applications. - Changle Zhi; Gang Dong; Deguang Yang; Xin Luo; Junpeng Yao; Daihang Liu; Zhangming Zhu (IEEE Internet Things J., 2025)