A 3DIC interconnect interface test and repair scheme based on Hybrid IEEE1838 Die Wrapper Register and BIST circuit. - Changming Cui; Junlin Huang (ETS, 2021)

Physical-aware Interconnect Testing and Repairing of Chiplets. - Changming Cui; Tuanhui Xu; Haitao Fu; Junlin Huang (ETS, 2023)