Micro Fluid device Using Thick Layer Piezo Actuator Prepared on Si Micro-machined Structure. - Sukhan Lee 001; Jaewoo Chung; Seungmo Lim; Changseung Lee (ICRA, 2001)

Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints. - Kunmo Chu; Changseung Lee; Sung-Hoon Park; Yoonchul Sohn (Microelectron. Reliab., 2017)