Analysis of the layout impact on electric fields in interconnect structures using finite element method. - Changsoo Hong; Linda Milor; M. Z. Lin (Microelectron. Reliab., 2004)

Study of Area Scaling Effect on Integrated Circuit Reliability Based on Yield Models. - Changsoo Hong; Linda S. Milor; Munkang Choi; Tom Lin (Microelectron. Reliab., 2005)

Modeling of the breakdown mechanisms for porous copper/low-k process flows. - Changsoo Hong; Linda Milor (Microelectron. Reliab., 2007)

Backend dielectric breakdown dependence on linewidth and pattern density. - Linda Milor; Changsoo Hong (Microelectron. Reliab., 2007)

Development of high-voltage ESD protection devices on smart power technologies for automotive applications. - Carol Rouying Zhan; Changsoo Hong; Jean-Philippe Lainé; Patrice Besse (ASICON, 2015)