A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. - Changsoo Jang; Seongyoung Han; Hangyu Kim; Sayoon Kang (Microelectron. Reliab., 2006)

Failure analysis of contact probe pins for SnPb and Sn applications. - Changsoo Jang; Seungbae Park; Bill Infantolino; Lawrence Lehman; Ryan Morgan; Dipak Sengupta (Microelectron. Reliab., 2008)

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. - Changsoo Jang; Byeng Dong Youn; Ping F. Wang; Bongtae Han; Suk-Jin Ham (Microelectron. Reliab., 2010)