Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization. - Sheng Hu; Huajun Sun; Jun Zhou; Qiong Zhan; Peng Sun; Beibei Sheng; Peng Zhu; Changtian Cao; Daohong Yang; Xiangshui Miao (Microelectron. J., 2026)