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Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology. - Wei Lu; Jie Zhang; Yi-Hui Wei; Hsu-Ming Hsiao; Sih-Han Li; Chao-Kai Hsu; Chih-Cheng Hsiao; Feng-Hsiang Lo; Shyh-Shyuan Sheu; Chin-Hung Wang; Wei-Chung Lo; Shih-Chieh Chang; et al. (VLSI Technology and Circuits, 2024)