Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. - Chao-Kun Hu; Kenneth P. Rodbell; Timothy D. Sullivan; Kim Y. Lee; Dennis P. Bouldin (IBM J. Res. Dev., 1995)

Electromigration of Cu/low dielectric constant interconnects. - Chao-Kun Hu; Lynne M. Gignac; R. Rosenberg (Microelectron. Reliab., 2006)

Future on-chip interconnect metallization and electromigration. - Chao-Kun Hu; James J. Kelly; Huai Huang; Koichi Motoyama; Hosadurga Shobha; Yuri Ostrovski; James H.-C. Chen; Raghuveer Patlolla; Brown Peethala; Praneet Adusumilli; Terry A. Spooner; Roger Quon; et al. (IRPS, 2018)