Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. - Chao-Yang Mao; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. - Hsin-En Cheng; Rong-Sheng Chen; Chao-Yang Mao (Qual. Reliab. Eng. Int., 2015)