Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. - Chaoqi Zhang 001; Paragkumar Thadesar; Muneeb Zia; Thomas E. Sarvey; Muhannad S. Bakir (3DIC, 2014)

Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. - Muneeb Zia; Chaoqi Zhang 001; Paragkumar Thadesar; Tracy Hookway; Taiyun Chi; Joe L. Gonzalez; Todd C. McDevitt; Hua Wang 006; Muhannad S. Bakir (BioCAS, 2015)

Chip-to-chip interconnect integration technologies. - Muneeb Zia; Chaoqi Zhang 001; Hyun Suk Yang; Li Zheng; Muhannad S. Bakir (IEICE Electron. Express, 2016)