Effect of wire diameter on the thermosonic bond reliability. - Sarangapani Murali; Narasimalu Srikanth; Charles J. Vath III (Microelectron. Reliab., 2006)

Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage. - Charles J. Vath III; M. Gunasekaran; Ramkumar Malliah (Microelectron. Reliab., 2011)