US Microelectronics Packaging Ecosystem: Challenges and Opportunities. - Rouhan Noor; Himanandhan Reddy Kottur; Patrick J. Craig; Liton Kumar Biswas; M. Shafkat M. Khan; Nitin Varshney; Hamed Dalir; Elif Akçali; Bahar Ghane Motlagh; Charles Woychik; Yong-Kyu Yoon; Navid Asadizanjani (CoRR, 2023)