Ball-grid-array solder joint model for assembly-level impact reliability prediction. - Chee Kuang Kok; Wen Jie Ng; Chin Chin Ooi; Kia Wai Liew (Microelectron. Reliab., 2016)

Heat Induction by Viscous Dissipation Subjected to Symmetric and Asymmetric Boundary Conditions on a Small Oscillating Flow in a Microchannel. - Chih Ping Tso; Chee Hao Hor; Gooi Mee Chen; Chee Kuang Kok (Symmetry, 2018)