Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. - Dau Fatt Lim; Shiv Govind Singh; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan (3DIC, 2009)

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress. - Meng Keong Lim; Jingyuan Lin; Yong Chiang Ee; Chee Mang Ng; Jun Wei; Chee Lip Gan (Microelectron. Reliab., 2012)