TDDB improvement of copper/dielectric in the highly-integrated BEOL structure for 28nm technology node and beyond. - Cheng Pu Chiu; Yen-Chun Liu; Bin-Siang Tsai; Yi-Jing Wang; Yeh-Sheng Lin; Yun-Ru Chen; Chien-Lin Weng; Sheng-Yuan Hsueh; Jack Hung; Ho-Yu Lai; Jei-Ming Chen; Albert H.-B. Cheng; et al. (IRPS, 2015)

Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node. - Li Chieh Hsu; Yu-Min Lin; Chien Liang Wu; Wei Kun Lee; Yen Chun Liu; Cheng Pu Chiu; Hsin Kuo Hsu; Chun Yi Wang; Chien Chung Huang 002; Chin Fu Lin (IRPS, 2015)