An Electromechanical Model and Simulation for Test Process of the Wafer Probe. - Junhui Li; Hailong Liao; Dasong Ge; Can Zhou; Chengdi Xiao; Qing Tian; Wenhui Zhu (IEEE Trans. Ind. Electron., 2017)

An activity-based defect management framework for product development. - Huimeng Zheng; Weidong Liu 007; Chengdi Xiao (Comput. Ind. Eng., 2018)

Structural relationship model for design defect and influencing factors in the concurrent design process. - Huimeng Zheng; Weidong Liu 007; Chengdi Xiao (Int. J. Prod. Res., 2018)

Investigation of Noise Sources in Fractional-Slot Concentrated Winding Motors Considering High-Order Radial/Tangential Electromagnetic Force Combination and Modulation. - Xi-Xin Rao; Lv Rong; Wusheng Gan; Chengdi Xiao; Yi Zhou (IEEE Access, 2023)

A real-time and efficient surface defect detection method based on YOLOv4. - Jiansheng Liu; Guolong Cui; Chengdi Xiao (J. Real Time Image Process., 2023)

Non-fourier phonon heat transport in graphene nanoribbon field effect transistors based on modified phonon hydrodynamic lattice Boltzmann method. - Xixin Rao; Songcheng Li; Yuancheng Yan; Haitao Zhang; Chengdi Xiao (Microelectron. J., 2024)

Thermal analysis of GaN HEMTs using nongray multi-speed phonon lattice Boltzmann method under Joule heating effect. - Xixin Rao; Yipeng Wu; Kongzhang Huang; Haitao Zhang; Chengdi Xiao (Microelectron. J., 2024)