Design of one chip communication stack processor and MMS communication stack library based on IEC 61850. - Eunkyu In; Jongju Park; Sangwoo Ahn; Cheoljon Jang; Jongwha Chong (NESEA, 2011)

IEC 61850 Standard Based MMS Communication Stack Design Using OOP. - Jongjoo Park; Eunkyu In; Sangwoo Ahn; Cheoljon Jang; Jongwha Chong (AINA Workshops, 2012)

Power bumps and through-silicon-vias placement with optimised power mesh structure for power delivery network in three-dimensional-integrated circuits. - Cheoljon Jang; Jaehwan Kim; Byung-Gyu Ahn; Jongwha Chong (IET Comput. Digit. Tech., 2013)

Power-aware floorplanning-based power throughsilicon- via technology and bump minimisation for three-dimensional power delivery network. - Cheoljon Jang; Jaehwan Kim; Jong-Wha Chong (IET Comput. Digit. Tech., 2014)