Using power diode models for circuit simulations-a comprehensive review. - Cher Ming Tan; King-Jet Tseng (IEEE Trans. Ind. Electron., 1999)

A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). - Cher Ming Tan; Kelvin Ngan Chong Yeo (J. Electron. Test., 2001)

Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. - S. S. Deng; Jun Wei 003; Cher Ming Tan; M. L. Nai; W. B. Yu; H. Xie (Int. J. Comput. Eng. Sci., 2003)

Influence Of Applied Load On Wafer Bonding In Vacuum. - W. B. Yu; Jun Wei 003; Cher Ming Tan; S. S. Deng; M. L. Nai (Int. J. Comput. Eng. Sci., 2003)

Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology. - Guan Zhang; Cher Ming Tan; Kok Tong Tan; Derek Sim Kwang Ye; W. Y. Zhang (Microelectron. Reliab., 2004)

Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. - Arijit Roy 001; Cher Ming Tan; Rakesh Kumar; Xian Tong Chen (Microelectron. Reliab., 2005)

Reliability screening through electrical testing for press-fit alternator power diode in automotive application. - Cher Ming Tan; Joe Chiu; Robert Liu; Guan Zhang (Microelectron. Reliab., 2005)

Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications. - Cher Ming Tan; Zhenghao Gan; Wai Fung Ho; Sam Chen; Robert Liu (Microelectron. Reliab., 2005)

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. - Cher Ming Tan; Kim Peng Lim; Tai Chong Chai; Guat Cheng Lim (Microelectron. Reliab., 2005)

Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. - Cher Ming Tan; Arijit Roy 001; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low (Microelectron. Reliab., 2005)

Device level electrical-thermal-stress coupled-field modeling. - Guangyu Huang; Cher Ming Tan (Microelectron. Reliab., 2006)

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. - Arijit Roy 001; Cher Ming Tan (Microelectron. Reliab., 2006)

Feasibility study of the application of voltage contrast to printed circuit board. - Cher Ming Tan; Zhenghao Gan; Tai Chong Chai (Microelectron. Reliab., 2006)

Development of highly accelerated electromigration test. - Cher Ming Tan; Wei Li; Kok Tong Tan; Frankie Low (Microelectron. Reliab., 2006)

Enhanced finite element modelling of Cu electromigration using ANSYS and matlab. - Wei Li; Cher Ming Tan (Microelectron. Reliab., 2007)

Room temperature observation of point defect on gold surface using thermovoltage mapping. - Arijit Roy 001; Cher Ming Tan; Sean J. O'Shea; Kedar Hippalgaonkar; Wulf Hofbauer (Microelectron. Reliab., 2007)

An approach to statistical analysis of gate oxide breakdown mechanisms. - Cher Ming Tan; Nagarajan Raghavan (Microelectron. Reliab., 2007)

Finite element modeling of capacitive coupling voltage contrast. - Cher Ming Tan; Stanny Yanuar; Tai Chong Chai (Microelectron. Reliab., 2007)

Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier. - Guangyu Huang; Cher Ming Tan (J. Electron. Test., 2008)

A framework to practical predictive maintenance modeling for multi-state systems. - Cher Ming Tan; Nagarajan Raghavan (Reliab. Eng. Syst. Saf., 2008)

Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI). - Jie Liao; Cher Ming Tan; Geert Spierings (Microelectron. Reliab., 2009)

Electromigration in width transition copper interconnect. - Arijit Roy 001; Yuejin Hou; Cher Ming Tan (Microelectron. Reliab., 2009)

Analysis of humidity effects on the degradation of high-power white LEDs. - Cher Ming Tan; Boon Khai Eric Chen; Gan Xu; Yuanjie Liu (Microelectron. Reliab., 2009)

Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems". - Cher Ming Tan; Nagarajan Raghavan (Reliab. Eng. Syst. Saf., 2009)

Electromigration in ULSI Interconnections - Cher Ming Tan (World Scientific, 2010)

Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects. - C. M. Fu; Cher Ming Tan; S. H. Wu; H. B. Yao (Microelectron. Reliab., 2010)

Circuit level interconnect reliability study using 3D circuit model. - Feifei He; Cher Ming Tan (Microelectron. Reliab., 2010)

Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model. - Feifei He; Cher Ming Tan (Microelectron. Reliab., 2010)

Humidity study of a-Si PV cell. - Cher Ming Tan; Boon Khai Eric Chen; Kok Peng Toh (Microelectron. Reliab., 2010)

Addressing the challenges in solder resistance measurement for electromigration test. - Yung Chuen Tan; Cher Ming Tan; T. C. Ng (Microelectron. Reliab., 2010)

Electromigration performance of Through Silicon Via (TSV) - A modeling approach. - Yung Chuen Tan; Cher Ming Tan; Xiaowu Zhang; Tai Chong Chai; D. Q. Yu (Microelectron. Reliab., 2010)

ICMAT 2011 - Reliability and variability of semiconductor devices and ICs. - Asen Asenov; Ulf Schlichtmann; Cher Ming Tan; Hei Wong; Xing Zhou (Microelectron. Reliab., 2012)

Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test. - Sihan Joseph Chen; Cher Ming Tan; Boon Khai Eric Chen; Zhi Yong Shaun Chua (Microelectron. Reliab., 2012)

Degradation behavior of high power light emitting diode under high frequency switching. - Sihan Chen; Cher Ming Tan; Guan Hong Tan; Feifei He (Microelectron. Reliab., 2012)

Electromigration reliability of interconnections in RF low noise amplifier circuit. - Feifei He; Cher Ming Tan (Microelectron. Reliab., 2012)

Effect of IC layout on the reliability of CMOS amplifiers. - Feifei He; Cher Ming Tan (Microelectron. Reliab., 2012)

Reliability study of LED driver - A case study of black box testing. - Song Lan; Cher Ming Tan; Kevin Wu (Microelectron. Reliab., 2012)

Applications of finite element methods for reliability study of ULSI interconnections. - Cher Ming Tan; Wei Li; Zhenghao Gan (Microelectron. Reliab., 2012)

The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. - Jiye Zhang; Lin Zhang; Yuanwei Dong; Hongyu Li; Cher Ming Tan; Guangrui Xia; Chuan Seng Tan (3DIC, 2013)

Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling. - Minh Duc Le; Cher Ming Tan (Reliab. Eng. Syst. Saf., 2013)

Special section reliability and variability of devices for circuits and systems. - Asen Asenov; Ulf Schlichtmann; Cher Ming Tan; Hei Wong; Xing Zhou (Microelectron. Reliab., 2014)

Modeling and analysis of gate-all-around silicon nanowire FET. - Xiangchen Chen; Cher Ming Tan (Microelectron. Reliab., 2014)

Methodology of reliability enhancement for high power LED driver. - Song Lan; Cher Ming Tan; Kevin Wu (Microelectron. Reliab., 2014)

Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter. - Cher Ming Tan; Wen Zhi Yu (Microelectron. Reliab., 2014)

A reliability-based design concept for lithium-ion battery pack in electric vehicles. - Zhitao Liu; Cher Ming Tan; Feng Leng (Reliab. Eng. Syst. Saf., 2015)

Editorial. - Asen Asenov; Ulf Schlichtmann; Cher Ming Tan; Hei Wong; Xing Zhou (Microelectron. Reliab., 2016)

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. - Marvin Chan; Cher Ming Tan; Kheng Chooi Lee; Chuan Seng Tan (Microelectron. Reliab., 2016)

Copper induced synthesis of graphene using amorphous carbon. - Udit Narula; Cher Ming Tan; Chao-Sung Lai (Microelectron. Reliab., 2016)

A review on the humidity reliability of high power white light LEDs. - Preetpal Singh; Cher Ming Tan (Microelectron. Reliab., 2016)

Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation. - Preetpal Singh; Cher Ming Tan; Liann-Be Chang (Microelectron. Reliab., 2016)

A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency. - Nirdosh; Cher Ming Tan; Malay Ranjan Tripathy (WOCC, 2018)

Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions. - Preetpal Singh; Cher Ming Tan (IEEE Access, 2018)

Electromagnetic Induced Failure in GaN-HEMT High-Frequency Power Amplifier. - Vivek Sangwan; Cher Ming Tan; Dipesh Kapoor; Hsien-Chin Chiu (IEEE Trans. Ind. Electron., 2020)

Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment. - Vimal Kant Pandey; Cher Ming Tan (Int. J. Circuit Theory Appl., 2022)

Concurrent Multiband CMOS Low Noise Amplifier Design for Internet of Things Applications. - Peerapat Phetpadriew; Bharatha Kumar Thangarasu; Nagarajan Mahalingam; Zhenghao Lu; Cher Ming Tan; Kiat Seng Yeo (ASICON, 2023)