Comparison of experimental, analytical and simulation methods to estimate substrate material properties for warpage reliability analysis. - Cheryl Selvanayagam; Rathin Mandal; Nagarajan Raghavan (Microelectron. Reliab., 2018)

Learning Localized Spatial Material Properties of Substrates in Ultra-Thin Packages Using Markov Chain Monte Carlo and Finite Element Analysis. - Cheryl Selvanayagam; Pham Luu Trung Duong; Nagarajan Raghavan (IEEE Access, 2020)

Inverse Design for Low Warpage Ultra-Thin Packages Using Constrained Particle Swarm Optimization. - Cheryl Selvanayagam; Pham Luu Trung Duong; Brett Wilkerson; Nagarajan Raghavan (IEEE Access, 2021)

Global Optimization of Surface Warpage for Inverse Design of Ultra-Thin Electronic Packages Using Tensor Train Decomposition. - Cheryl Selvanayagam; Pham Luu Trung Duong; Brett Wilkerson; Nagarajan Raghavan (IEEE Access, 2022)