Advanced CMOS reliability challenges. - Chetan Prasad (VLSI-DAT, 2014)

Transistor reliability variation correlation to threshold voltage. - Stephen Ramey; M. Chahal; P. Nayak; Steven R. Novak; Chetan Prasad; Jeffery Hicks (IRPS, 2015)

A 14 nm SoC platform technology featuring 2nd generation Tri-Gate transistors, 70 nm gate pitch, 52 nm metal pitch, and 0.0499 um2 SRAM cells, optimized for low power, high performance and high density SoC products. - Chia-Hong Jan; F. Al-amoody; H.-Y. Chang; T. Chang; Y.-W. Chen; N. Dias; Walid M. Hafez; Doug B. Ingerly; M. Jang; Eric Karl; S. K.-Y. Shi; K. Komeyli; et al. (VLSIC, 2015)

Technology scaling implications for BTI reliability. - Stephen M. Ramey; Chetan Prasad; A. Rahman (Microelectron. Reliab., 2018)

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. - Chetan Prasad; Sunny Chugh; Hannes Greve; I-chen Ho; Enamul Kabir; Cheyun Lin; Mahjabin Maksud; Steven R. Novak; Benjamin Orr; Keun Woo Park; Anthony Schmitz; Zhizheng Zhang 006; et al. (IRPS, 2020)

Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing. - Bernhard Sell; S. An; J. Armstrong; D. Bahr; B. Bains; Rohan Bambery; K. Bang; D. Basu; S. Bendapudi; D. Bergstrom; R. Bhandavat; S. Bhowmick; et al. (VLSI Technology and Circuits, 2022)

Reliability Studies on Advanced FinFET Transistors of the Intel 4 CMOS Technology. - M. Jamil; S. Mukhopadhay; M. Ghoneim; A. Shailos; Chetan Prasad; Inanc Meric; Stephen Ramey (IRPS, 2023)

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. - Walid M. Hafez; P. Agnihotri; M. Asoro; M. Aykol; B. Bains; Rohan Bambery; M. Bapna; A. Barik; A. Chatterjee; P. C. Chiu; T. Chu; C. Firby; et al. (VLSI Technology and Circuits, 2023)

mCLM: A Function-Infused and Synthesis-Friendly Modular Chemical Language Model. - Carl Edwards; Chi Han; Gawon Lee; Thao Nguyen; Bowen Jin; Chetan Prasad; Sara Szymkuc; Bartosz A. Grzybowski; Ying Diao; Jiawei Han 001; Ge Liu; Hao Peng 009; et al. (CoRR, 2025)