Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process. - Cheyun Lin; Uygar E. Avci; M. A. Blount; Rohit Grover; Jeffery Hicks; R. Kasim; A. Kundu; C. M. Pelto; C. Ryder; Anthony Schmitz; K. Sethi; D. Seghete; et al. (IRPS, 2020)

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. - Chetan Prasad; Sunny Chugh; Hannes Greve; I-chen Ho; Enamul Kabir; Cheyun Lin; Mahjabin Maksud; Steven R. Novak; Benjamin Orr; Keun Woo Park; Anthony Schmitz; Zhizheng Zhang 006; et al. (IRPS, 2020)

Intrinsic Reliability of BEOL interlayer dielectric. - James Palmer 002; Galor Zhang; Justin R. Weber; Cheyun Lin; Christopher Perini; Rahim Kasim (IRPS, 2021)

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. - Rahim Kasim; Cheyun Lin; Christopher Perini; James Palmer 002; N. Gilda; S. Imam; Justin R. Weber; C. Wallace; Jeffery Hicks (IRPS, 2023)