Influences of the moisture absorption on PBGA package's warpage during IR reflow process. - Chi-Hui Chien; Yung-Chang Chen; Yii-Tay Chiou; Thaiping Chen; Chi-Chang Hsieh; Jia-Jin Yan; Wei-Zhi Chen; Yii-Der Wu (Microelectron. Reliab., 2003)

Stability of the warpage in a PBGA package subjected to hygro-thermal loading. - Chi-Hui Chien; Thaiping Chen; Yung-Chang Chen; Yii-Tay Chiou; Chi-Chang Hsieh; Yii-Der Wu (Microelectron. Reliab., 2006)

Experimental and statistical study in adhesion features of bonded interfaces of IC packages. - Chi-Hui Chien; Thaiping Chen; Wei-Bang Lin; Chi-Chang Hsieh; Yii-Der Wu; Cheng-Hsiu Yeh (Microelectron. Reliab., 2008)

A strategy for the risk-based inspection of pressure safety valves. - Chi-Hui Chien; Chun-Hung Chen; Yuh J. Chao (Reliab. Eng. Syst. Saf., 2009)