The effect of tin grain structure on whisker growth. - Cheng-Fu Yu; Chi-Ming Chan; Ker-Chang Hsieh (Microelectron. Reliab., 2010)

Cu wire bond microstructure analysis and failure mechanism. - Cheng-Fu Yu; Chi-Ming Chan; Li-Chun Chan; Ker-Chang Hsieh (Microelectron. Reliab., 2011)