On-chip self-calibrated process-temperature sensor for TSV 3D integration. - Tzu-Ting Chiang; Po-Tsang Huang; Ching-Te Chuang; Kuan-Neng Chen; Jin-Chern Chiou; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Wei Hwang (SoCC, 2012)

Low temperature (<180 °C) bonding for 3D integration. - Yan-Pin Huang; Ruoh-Ning Tzeng; Yu-San Chien; Ming-Shaw Shy; Teu-Hua Lin; Kuo-Hua Chen; Ching-Te Chuang; Wei Hwang; Chi-Tsung Chiu; Ho-Ming Tong; Kuan-Neng Chen (3DIC, 2013)

Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications. - Teng-Chieh Huang; Po-Tsang Huang; Shang-Lin Wu; Kuan-Neng Chen; Jin-Chern Chiou; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Ching-Te Chuang; Wei Hwang (BioCAS, 2013)

Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection. - Ming-Hung Chang; Shang-Yuan Lin; Pei-Chen Wu; Olesya Zakoretska; Ching-Te Chuang; Kuan-Neng Chen; Chen-Chao Wang; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Wei Hwang (ISCAS, 2013)

Through-silicon-via-based double-side integrated microsystem for neural sensing applications. - Chih-Wei Chang; Po-Tsang Huang; Lei-Chun Chou; Shang-Lin Wu; Shih-Wei Lee; Ching-Te Chuang; Kuan-Neng Chen; Jin-Chern Chiou; Wei Hwang; Yen-Chi Lee; Chung-Hsi Wu; Kuo-Hua Chen; et al. (ISSCC, 2013)

Energy-efficient configurable discrete wavelet transform for neural sensing applications. - Tang-Hsuan Wang; Po-Tsang Huang; Kuan-Neng Chen; Jin-Chern Chiou; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Ching-Te Chuang; Wei Hwang (ISCAS, 2014)

18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. - Po-Tsang Huang; Lei-Chun Chou; Teng-Chieh Huang; Shang-Lin Wu; Tang-Shuan Wang; Yu-Rou Lin; Chuan-An Cheng; Wen-Wei Shen; Kuan-Neng Chen; Jin-Chern Chiou; Ching-Te Chuang; Wei Hwang; et al. (ISSCC, 2014)

Energy-efficient low-noise 16-channel analog-front-end circuit for bio-potential acquisition. - Shang-Lin Wu; Po-Tsang Huang; Teng-Chieh Huang; Kuan-Neng Chen; Jin-Chern Chiou; Kuo-Hua Chen; Chi-Tsung Chiu; Ho-Ming Tong; Ching-Te Chuang; Wei Hwang (VLSI-DAT, 2014)

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. - Chuan-An Cheng; Ryuichi Sugie; Tomoyuki Uchida; Kou-Hua Chen; Chi-Tsung Chiu; Kuan-Neng Chen (3DIC, 2015)