Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. - Chia-Hsuan Lee 003; Hsin-Chi Chang; Jui-Han Liu; Hiroyuki Ito; Young-Suk Kim; Kuan-Neng Chen; Takayuki Ohba (3DIC, 2019)

Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. - Yi-Chieh Tsai; Chia-Hsuan Lee 003; Kuan-Neng Chen (3DIC, 2019)