Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. - Tao-Chih Chang; Chang-Chun Lee; Chia-Ping Hsieh; Sheng-Che Hung; Ren-Shin Cheng (Microelectron. Reliab., 2015)

Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays. - Chang-Chun Lee; Chuan-Hsi Liu; Dian-Yong Li; Chia-Ping Hsieh (Microelectron. Reliab., 2018)