Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. - Chia-Tai Kuo; Ming-Chuen Yip; Kuo-Ning Chiang (Microelectron. Reliab., 2004)

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. - Chih-Tang Peng; Chia-Tai Kuo; Kuo-Ning Chiang; Terry Ku; Kenny Chang (Microelectron. Reliab., 2006)