Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps. - Cheng-Chen Lin; Liann-Be Chang; Ming-Jer Jeng; Chia-Yi Yen; Atanu Das; Chung-Yi Tang; Ming-Yi Tsai; Mu-Jen Lai (Microelectron. Reliab., 2010)

Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts. - Ming-Jer Jeng; Kuo-Ling Chiang; Hsin-Yi Chang; Chia-Yi Yen; Cheng-Chen Lin; Yuan-Hsiao Chang; Mu-Jen Lai; Yu-Lin Lee; Liann-Be Chang (Microelectron. Reliab., 2012)

A Computational Analysis of the Dynamics of R Style Based on 108 Million Lines of Code from All CRAN Packages in the Past 21 Years. - Chia-Yi Yen; Mia Huai-Wen Chang; Chung-hong Chan (R J., 2022)