A review of lead-free solders for electronics applications. - Shunfeng Cheng; Chien-Ming Huang 004; Michael G. Pecht (Microelectron. Reliab., 2017)

Risk of tin whiskers in the nuclear industry. - Chien-Ming Huang 004; Daniel Nunez; James Coburn; Michael G. Pecht (Microelectron. Reliab., 2018)

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. - Chien-Ming Huang 004; Anto Raj; Michael D. Osterman; Michael G. Pecht (IEEE Access, 2020)