How the Perception of Project Success and Accountability Affect the IS process Document Completeness. - Te Wei; Chih Chen; Krishnamurthy Surysekar (AMCIS, 2006)

Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs. - Zhen-Ying Hsieh; Mu-Chun Wang; Chih Chen; Jia-Min Shieh; Yu-Ting Lin; Shuang-Yuan Chen; Heng-Sheng Huang (Microelectron. Reliab., 2009)

Effect of bump size on current density and temperature distributions in flip-chip solder joints. - Wei-Chih Kuan; S. W. Liang; Chih Chen (Microelectron. Reliab., 2009)

The electromigration investigation of Cu-Ni nanocomposites. - Y. C. Chen; Chia Wei Chu; Tzu-Yuan Chao; Y. T. Cheng; Chih Chen (NEMS, 2012)

Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. - Y. W. Chang; H. Y. Peng; R. W. Yang; Chih Chen; T. C. Chang; Chau-Jie Zhan; Jin-Ye Juang; Annie T. Huang (Microelectron. Reliab., 2013)

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. - King-Ning Tu; Hsiang-Yao Hsiao; Chih Chen (Microelectron. Reliab., 2013)

Growth competition between layer-type and porous-type Cu3Sn in microbumps. - David T. Chu; Yi-Cheng Chu; Jie-An Lin; Yi-Ting Chen; Chun-Chieh Wang; Yen-Fang Song; Cheng-Cheng Chiang; Chih Chen; King-Ning Tu (Microelectron. Reliab., 2017)

Thermo-Mechanical Stress and Its Effect on the Fabrication and Reliability of Cu-SiO2 Hybrid Bonds for 3D IC Heterogeneous Integration (Invited). - Chih Chen; Shih-Chi Yang; You-Yi Lin; Huai-En Lin; Dinh-Phuc Tran (IRPS, 2025)