Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. - Kyosuke Kobinata; Tatsuya Funaki; Yoshiaki Satake; Hitoshi Matsuno; Seiji Hidaka; Shunsuke Abe; Hiroyuki Ito; Chih-Cheng Hsiao; Sheng Yi Li; Young-Suk Kim; Takayuki Ohba (VLSI Technology and Circuits, 2022)

Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology. - Wei Lu; Jie Zhang; Yi-Hui Wei; Hsu-Ming Hsiao; Sih-Han Li; Chao-Kai Hsu; Chih-Cheng Hsiao; Feng-Hsiang Lo; Shyh-Shyuan Sheu; Chin-Hung Wang; Wei-Chung Lo; Shih-Chieh Chang; et al. (VLSI Technology and Circuits, 2024)