Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations. - Chi-Pu Lin; Chih-Ming Chen 002 (Microelectron. Reliab., 2012)

Improvement of thermal management of high-power GaN-based light-emitting diodes. - Bo-Hung Liou; Chih-Ming Chen 002; Ray-Hua Horng; Yi-Chen Chiang; Dong-Sing Wuu (Microelectron. Reliab., 2012)

Effect of polyimide baking on bump resistance in flip-chip solder joints. - Hsi-Kuei Cheng; Shien-Ping Feng; Yi-Jen Lai; Kuo-Chio Liu; Ying-Lang Wang; Tzeng-Feng Liu; Chih-Ming Chen 002 (Microelectron. Reliab., 2014)

Planar copper-tin inter-metallic film formation on strained substrates. - Feng-Chih Hsu; Ya-Chi Cheng; Yu-Ting Wang; Ming-Tzer Lin; Chih-Ming Chen 002 (Microelectron. Reliab., 2014)

Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate. - Yee-Wen Yen; Ruo-Syun Syu; Chih-Ming Chen 002; Chien-Chung Jao; Guan-Da Chen (Microelectron. Reliab., 2014)

Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material. - Tzu-Hao Wang; Hsuan Lee; Chih-Ming Chen 002; Ming-Guan Chen; Chi-Chang Hu; Yu-Jie Chen; Ray-Hua Horng (Microelectron. Reliab., 2016)