Accurate numerical simulations of capillary underfill process for flip-chip packages. - Yu-Chi Cheng; Yu-Hsien Chen; Hao-Hsi Hung; Sheng-Jye Hwang; Dao-Long Chen; Hui-Jing Chang; Bing-Yuan Huang; Hung-Hsien Huang; Chen-Chao Wang; Chih-Pin Hung (Eng. Comput., 2025)