110 GHz Bandwidth Flip-Chip Bonded EML for High-Speed IM-DD Applications. - Kei Masuyama; Mizuki Shirao; Asami Uchiyama; Takuma Fujita; Seiu Higashide; Kenichi Abe; Chikara Watatani; Shunto Katsumi; Nobuo Ohata (ECOC, 2025)