An improvement of secure authentication scheme with full anonymity for wireless communications. - Chin-Hung Wang; Tzu-Chieh Wei; Po-Chin Lee; Chia-Chun Wu (ICIS, 2009)

A DEP chip with arc-shape microelectrode arrays for the separation of different-size particles. - Cheng-Hsin Chuang; Yu-Chi Chen; You-Ming Hsu; Huei-Sheng Huang; Fei-Bin Hsiao; Chin-Hung Wang (NEMS, 2009)

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. - Jie Zhang; Wei Lu; Po-Tsang Huang; Sih-Han Li; Tsung-Yi Hung; Shih-Hsien Wu; Ming-Ji Dai; I-Shan Chung; Wen-Chao Chen; Chin-Hung Wang; Shyh-Shyuan Sheu; Hung-Ming Chen; et al. (VLSI Technology and Circuits, 2022)

Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology. - Wei Lu; Jie Zhang; Yi-Hui Wei; Hsu-Ming Hsiao; Sih-Han Li; Chao-Kai Hsu; Chih-Cheng Hsiao; Feng-Hsiang Lo; Shyh-Shyuan Sheu; Chin-Hung Wang; Wei-Chung Lo; Shih-Chieh Chang; et al. (VLSI Technology and Circuits, 2024)