Characteristics of current crowding in flip-chip solder bumps. - Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. - Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Evaluation of board-level reliability of electronic packages under consecutive drops. - Chang-Lin Yeh; Yi-Shao Lai; Chin-Li Kao (Microelectron. Reliab., 2006)

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. - Yi-Shao Lai; Kuo-Ming Chen; Chin-Li Kao; Chiu-Wen Lee; Ying-Ta Chiu (Microelectron. Reliab., 2007)

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. - Theresa Sze; Darko Popovic; Jing Shi; Yi-Shao Lai; James G. Mitchell; Bruce Guenin; Tsung-Yueh Tsai; Chin-Li Kao; Matthew Giere (Microelectron. Reliab., 2010)

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. - Chin-Li Kao; Tei-Chen Chen; Yi-Shao Lai; Ying-Ta Chiu (Microelectron. Reliab., 2014)

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. - Yeonsung Kim; Ah-Young Park; Chin-Li Kao; Michael Su; Bryan Black; Seungbae Park (Microelectron. Reliab., 2016)

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. - Chin-Li Kao; Tei-Chen Chen (Microelectron. Reliab., 2018)