A thermo-mechanical study on the electrical resistance of aluminum wire conductors. - De-Shin Liu; Chin-Yu Ni (Microelectron. Reliab., 2002)

The optimization design of bump interconnections in flip chip packages from the electrical standpoint. - De-Shin Liu; Chin-Yu Ni (Microelectron. Reliab., 2002)

Procedure for design optimization of a T-cap flip chip package. - Chin-Yu Ni; De-Shin Liu; Ching-Yang Chen (Microelectron. Reliab., 2002)