Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging. - Yun Chen 002; Shuquan Ding; Junyu Long; Maoxiang Hou; Xin Chen 005; Jian Gao 002; Yunbo He; Ching-Ping Wong (IEEE Access, 2020)