Electromigration Performance of Cu Bumps in Various Configurations. - Jui-Shen Chang; Chung-Yu Chiu; Ching-Ting Liu; Chen-Nan Chiu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives. - Ching-Ting Liu; Yao-Chun Chuang; Jyun-Lin Wu; Jia-Shen Lan; Chang-Fu Han; Chia-Hua Chang; Jia-Ming Yang; Yu-Sheng Lin; Chen-Wei Li; Ryan Lu (IRPS, 2025)