Procedure for design optimization of a T-cap flip chip package. - Chin-Yu Ni; De-Shin Liu; Ching-Yang Chen (Microelectron. Reliab., 2002)

Design of a novel chip on glass package solution for CMOS image sensor device. - Ching-Yang Chen; Yung-Ching Chao; De-Shin Liu; Zhen-Wei Zhuang (Microelectron. Reliab., 2006)

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method. - De-Shin Liu; Zhen-Wei Zhuang; Ching-Yang Chen; Cho-Liang Chung (Microelectron. Reliab., 2010)