Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. - K. W. Lee; Chisato Nagai; Ai Nakamura; Ji Chel Bea; Mariappan Murugesan; Takafumi Fukushima; Tanaka Tanaka; Mitsumasa Koyanagi (3DIC, 2014)

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. - Takafumi Fukushima; Taku Suzuki; Hideto Hashiguchi; Chisato Nagai; Jichoel Bea; Hiroyuki Hashimoto; Mariappan Murugesan; Kang Wook Lee 002; Tetsu Tanaka; Kazushi Asami; Yasuhiro Kitamura; Mitsumasa Koyanagi (3DIC, 2015)

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. - K. W. Lee; Chisato Nagai; Ai Nakamura; Hiroki Aizawa; Ji Chel Bea; Mitsumasa Koyanagi; Hideto Hashiguchi; Takafumi Fukushima; Tanaka Tanaka (3DIC, 2015)