Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. - Yi-Shao Lai; Kuo-Ming Chen; Chin-Li Kao; Chiu-Wen Lee; Ying-Ta Chiu (Microelectron. Reliab., 2007)