Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). - Cho-Liang Chung; Liang-Tien Lu; Yao-Jung Lee (Microelectron. Reliab., 2005)

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method. - De-Shin Liu; Zhen-Wei Zhuang; Ching-Yang Chen; Cho-Liang Chung (Microelectron. Reliab., 2010)