Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online). - Chong Leong Gan; Classe Francis; Bak Lee Chan; Uda Hashim (Microelectron. Reliab., 2014)

Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). - Chong Leong Gan; Uda Hashim (Microelectron. Reliab., 2015)

Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2. - Chong Leong Gan; Uda Hashim (Microelectron. Reliab., 2015)

Book Review: Fundamentals of Bias Temperature Instability in MOS Transistors. Springer (2016). - Chong Leong Gan (Microelectron. Reliab., 2016)

3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9. - Chong Leong Gan; Uda Hashim (Microelectron. Reliab., 2016)

3D Flash Memories. - Chong Leong Gan; Uda Hashim (Microelectron. Reliab., 2016)

Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications (2017), Springer, ISBN: ISBN 978-3-319-29744-6 (Print) ISBN 978-3-319-29746-0 (Online). - Chong Leong Gan; Mohamad Zainudeen Moideen (Microelectron. Reliab., 2017)

Soft error mechanisms, modeling and mitigation. Springer (2016). - Chong Leong Gan; Mohamad Zainudeen Moideen (Microelectron. Reliab., 2017)