No-flow underfill flip chip assembly–an experimental and modeling analysis. - Hua Lu 003; K. C. Hung; Stoyan Stoyanov; Chris Bailey 001; Y. C. Chan (Microelectron. Reliab., 2002)

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. - Chunyan Yin; M. O. Alam; Yan Cheong Chan; Chris Bailey 001; Hua Lu 003 (Microelectron. Reliab., 2003)

Study of anisotropic conductive adhesive joint behavior under 3-point bending. - M. J. Rizvi; Y. C. Chan; Chris Bailey 001; Hua Lu 003 (Microelectron. Reliab., 2005)

Assessing the performance of crack detection tests for solder joints. - Stephen Ridout; Milos Dusek; Chris Bailey 001; Chris Hunt (Microelectron. Reliab., 2006)

Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. - Stoyan Stoyanov; Robert W. Kay; Chris Bailey 001; Marc P. Y. Desmulliez (Microelectron. Reliab., 2007)

Open Ended Microwave Oven for Packaging - Keith I. Sinclair; Tim Tilford; Marc P. Y. Desmulliez; George Goussetis; Chris Bailey 001; Kevin Parrott; Alan J. Sangster (CoRR, 2008)

Failure mechanisms of ACF joints under isothermal ageing. - M. J. Rizvi; Chris Bailey 001; Hua Lu 003 (Microelectron. J., 2008)

Design for reliability of power electronics modules. - Hua Lu 003; Chris Bailey 001; Chunyan Yin (Microelectron. Reliab., 2009)

A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. - E. Kamara; Hua Lu 003; Chris Bailey 001; Chris Hunt; Davide Di Maio; Owen Thomas (Microelectron. Reliab., 2010)

Integration of analytical techniques in stochastic optimization of microsystem reliability. - Xiangdong Xue; Chris Bailey 001; Hua Lu 003; Stoyan Stoyanov (Microelectron. Reliab., 2011)

Fusion Approach for Prognostics Framework of Heritage Structure. - Yasmine Z. Rosunally; Stoyan Stoyanov; Chris Bailey 001; Peter Mason; Sheelagh Campbell; George Monger; Ian Bell (IEEE Trans. Reliab., 2011)

Prognostics and Health Monitoring of High Power LED. - Thamo Sutharssan; Stoyan Stoyanov; Chris Bailey 001; Yasmine Z. Rosunally (Micromachines, 2012)

Modelling methodology for thermal analysis of hot solder dip process. - Stoyan Stoyanov; Chris Bailey 001; M. O. Alam; Chunyan Yin; Chris Best; Peter Tollafield; Rob Crawford; Mike Parker; Jim Scott (Microelectron. Reliab., 2013)

New topic session 2B: Co-design and reliability of power electronic modules - Current status and future challenges. - Bozena Kaminska; Bernard Courtois; Chris Bailey 001 (VTS, 2014)

Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. - Mahera Musallam; Chunyan Yin; Chris Bailey 001; C. Mark Johnson (Microelectron. Reliab., 2014)

Sintered silver finite element modelling and reliability based design optimisation in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

Modelling the impact of refinishing processes on COTS components for use in aerospace applications. - Stoyan Stoyanov; Chris Bailey 001 (Microelectron. Reliab., 2015)

Statistical analysis of the impact of refinishing process on leaded components. - Chunyan Yin; Chris Best; Chris Bailey 001; Stoyan Stoyanov (Microelectron. Reliab., 2015)

Similarity approach for reducing qualification tests of electronic components. - Stoyan Stoyanov; Chris Bailey 001; Georgios Tourloukis (Microelectron. Reliab., 2016)

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001; Jose Angel Ortiz Gonzalez; Olayiwola Alatise (Microelectron. Reliab., 2017)

Evaluation of SiC Schottky Diodes Using Pressure Contacts. - Jose Angel Ortiz Gonzalez; Olayiwola Alatise; Attahir Murtala Aliyu; Pushparajah Rajaguru; Alberto Castellazzi; Li Ran; Philip Mawby; Chris Bailey 001 (IEEE Trans. Ind. Electron., 2017)

Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radar. - Jamie Blanche; David Flynn; Helen Lewis; Gary D. Couples; Jim Buckman; Chris Bailey 001; Tim Tilford (IEEE Access, 2018)

An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. - Kenneth Chimezie Nwanoro; Hua Lu 003; Chunyan Yin; Chris Bailey 001 (Microelectron. Reliab., 2018)

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. - Pushparajah Rajaguru; H. Lu; Chris Bailey 001; Alberto Castellazzi; V. Pathirana; N. Udugampola; Florin Udrea (Microelectron. Reliab., 2018)

Design, manufacture and test for reliable 3D printed electronics packaging. - Tim Tilford; Stoyan Stoyanov; Jessica B. S. Langbaum; Jan Christoph Janhsen; Matthias Burgard; Richard B. Buxton; Chris Bailey 001 (Microelectron. Reliab., 2018)

Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. - Fateme Dinmohammadi; David Flynn; Chris Bailey 001; Michael G. Pecht; Chunyan Yin; Pushparajah Rajaguru; Valentin Robu (IEEE Access, 2019)

Data analytics to reduce stop-on-fail test in electronics manufacturing. - Ana Elsa Hinojosa Herrera; Stoyan Stoyanov; Chris Bailey 001; Chris Walshaw; Chunyan Yin (Open Comput. Sci., 2019)

Predictive analytics methodology for smart qualification testing of electronic components. - Stoyan Stoyanov; Mominul Ahsan; Chris Bailey 001; Tracy Wotherspoon; Craig Hunt (J. Intell. Manuf., 2019)

Developing Computational Intelligence for Smart Qualification Testing of Electronic Products. - Mominul Ahsan; Stoyan Stoyanov; Chris Bailey 001; Alhussein Albarbar (IEEE Access, 2020)

Modeling Insights Into the Assembly Challenges of Focal Plane Arrays. - Stoyan Stoyanov; Chris Bailey 001 (IEEE Access, 2023)

Package Modeling and Analysis for Heterogeneous Integration. - Chris Bailey 001; Leslie Hwang; Fnu Pallavi Praful (ICCAD, 2024)

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. - Pushparajah Rajaguru; Tim Tilford; Chris Bailey 001; Stoyan Stoyanov (IEEE Access, 2024)